Sony recently published a teardown of the PlayStation 5 Pro, showcasing important cooling improvements in their newest console. The company specifically upgraded the liquid metal cooling system to provide more stable temperature control for the powerful hardware.
This update follows some previous concerns about the original PS5’s cooling design. There were rumors that liquid metal could leak and damage consoles, leading to recommendations against vertical placement. However, these claims were largely unsubstantiated and stemmed from a misquoted repair specialist. The website that started this story later admitted to a “critical misunderstanding” in their reporting.
Enhanced Cooling Technology
I learned that Sony took extra steps with the PS5 Pro’s cooling system. PS5 Pro Mechanical Design Lead Shinya Tsuchida explained: “We made improvements by adding fine grooves where the liquid metal is applied, so the cooling effect is more stable. When researching for the original PS5, we knew semiconductors would become much denser, so liquid metal technology would be crucial. It turns out we were right, and it was integral when designing the PS5 Pro.”
The cooling upgrades don’t stop there. The PS5 Pro features a larger cooling fan with redesigned blades, including smaller blades positioned between the main ones for better airflow. This explains why the recent iFixit teardown showed the console contains more thermal management components than electronics.
Advanced Motherboard Design
The motherboard itself has also been completely redesigned. Many observers noticed it’s difficult to see traces on the PS5 Pro’s board – this is because Sony hid additional electrical layers underneath to speed up memory access. This multi-layered approach allows for faster performance while managing the heat generated by the console’s enhanced processing capabilities.
These upgrades show that Sony really focused on making the PS5 Pro strong enough for high-end gaming without heating up too much.
